As the global electronics industry stands at a crucial intersection between the deepening application of AI technology and the accelerated green transformation, an event focusing on technological innovation and industrial collaboration has become a crucial link connecting upstream and downstream industries and promoting technology implementation.
From August 26 to 28, 2025, the 22nd Shenzhen International Electronics Show and Embedded World (elexcon) concluded successfully at the Shenzhen Convention and Exhibition Center (Futian). Themed “All for AI, All for GREEN,” this event, with its deep insights into electronics and embedded systems, not only brought together technology developers, product manufacturers, and market decision-makers from around the world, but also built a bridge from technological conception to market implementation by precisely addressing industry pain points. Whether it is edge intelligence solutions seeking breakthroughs in computing power, energy-saving technologies adapted to the “dual carbon” goals, or advanced packaging solutions that break through chip performance bottlenecks, participants can find technical resonance and cooperation opportunities here. The exhibition’s unique “display-communication-matching” model has made this event transcend the scope of traditional exhibitions and injected new vitality and direction into the development of the industry.
1. Scale and Participation: Over 400 Exhibitors and 10,000 Professional Visitors Gathered
This year’s exhibition, with its in-depth coverage of the electronics and embedded systems sectors, attracted over 400 global embedded and electronic technology suppliers, representing the entire industry chain, from chip design to component manufacturing to system integration.
In terms of visitor participation, the exhibition welcomed over 10,000 professional visitors on the first day, including hardware engineers, R&D leaders, purchasing managers, and corporate decision-makers. They primarily represented over 20 niche sectors, including smart hardware, automotive electronics, industrial automation, new energy, and the Internet of Things. Throughout the exhibition period, average daily visitor traffic remained high across all exhibition areas. Popular areas (such as the AI Computing Solutions Zone and the Advanced Packaging Zone) were frequently filled with queues and long lines. This clearly demonstrated the exhibition’s brand appeal and resource aggregation capabilities within the industry, making it a crucial hub connecting both supply and demand for the global electronics industry.
2, Exhibition Content: Focus on cutting-edge technologies and cover innovative achievements in multiple fields
- Embedded AI and Edge Computing Take Center Stage: A Full-Chain Breakthrough from “Computing Power Adaptation” to “Scenario Implementation”
At this year’s exhibition, the presentation of embedded AI and edge computing went beyond simply showcasing hardware performance. Instead, it encompassed a comprehensive solution chain encompassing “algorithms, computing power, and scenarios,” becoming the core of all technical discussions. Numerous exhibitors showcased innovative products and solutions focused on embedded AI and edge computing. For example, in the areas of AI algorithm optimization and edge computing power enhancement, companies demonstrated how to efficiently deploy complex AI models on edge devices, enabling real-time data processing and decision-making, driving intelligent upgrades in areas such as industrial automation, smart homes, and smart security.
- Green Technology Permeates the Entire Energy Electronics Industry Chain: Technological Innovation Focused on “Efficient Energy Saving”
Against the backdrop of the “dual carbon” goals and the global energy transition, green technology became a core theme in the energy electronics exhibition area. Exhibitors showcased energy-saving solutions across new energy, automotive electronics, and industrial automation, encompassing three key areas: power management chip design, new power topology architectures, and energy recovery technology. Many companies have launched new power supply products that improve energy conversion efficiency while reducing energy consumption, meeting the demands of the era of green development.
- Breakthroughs in Advanced Semiconductor Packaging Technology: Chiplets and Glass Substrates Solve the “Hash Power-Size” Dilemma
The semiconductor exhibition area, centered on “Breakthroughs in Advanced Packaging Technology,” focused on two cutting-edge areas: heterogeneous chiplet system integration and PLP/TGV (Through Glass Via) glass substrates. It showcased packaging solutions for high-performance applications like AI and 5G, effectively addressing the core dilemma of increasing chip computing power while reducing chip size. Numerous companies have achieved breakthroughs in advanced packaging technology, effectively improving chip performance and integration, providing critical technical support for AI, 5G, and other areas with stringent requirements for chip computing power and size.
3, Concurrent activities: Multiple forums with in-depth discussions and a strong atmosphere of technical exchange
Over 15 professional forums were held concurrently with the exhibition, covering hot topics such as AI computing power, intelligent cockpits, the three-electric (three-power) technologies of new energy vehicles, and advanced packaging. At the 7th China Embedded Technology Conference 2025, industry leaders from Qualcomm, Renesas, ARM, and NXP delivered keynote speeches on hot topics such as embedded AI, edge AI, edge-tested AI, and embodied intelligence, sharing the latest industry technology trends and application cases.
4, Featured Zones: AI toys, robots, and AI glasses ecosystems are highly sought after – a panoramic presentation from technology implementation to scenario experience
The AI Toys, Robots, and AI Glasses Ecosystem Zone at this year’s exhibition, with its distinctive features of “visualized technology and perceptible scenarios,” became a popular attraction, attracting not only visitors and makers but also companies in the smart hardware and consumer electronics sectors.
This zone goes beyond a simple product display; instead, it showcases a comprehensive chain of technology applications and user experiences, centered around “AI + consumer scenarios.” It showcases a wide range of innovative products incorporating AI technology, from toys with intelligent interactive features to robots capable of performing complex tasks to versatile AI glasses. This showcase demonstrates how AI technology is deeply integrated into daily life, bringing new experiences to consumers and providing a wealth of creative inspiration and application examples for the development of related industries.
This ecosystem zone, through a combination of product experiences, technical explanations, and scenario demonstrations, made the once-abstract AI technology tangible and tangible. This not only provided general visitors with an opportunity to get up close and personal with AI consumer products, but also served as a platform for technical exchange and demand matching for related industry companies. During the exhibition, many exhibitors reached partnership agreements with downstream distributors and content service providers, driving AI technology from exhibition displays to market implementation and further enriching the application ecosystem of embedded technology in both consumer and industrial sectors.
5. Exhibition Achievements: Promoting Industry Exchange and Cooperation and Pointing Out the Future Development Direction
As an annual industry hub for electronics and embedded systems, this exhibition, through its three-dimensional “exhibition + exchange + matchmaking” model, not only established an efficient collaborative platform covering the entire industry chain (chips – components – systems – applications), but also promoted the precise matching of technological innovation with market demand, achieving value transformation from “technology display” to “implemented collaboration,” injecting substantial momentum into industry development. This exhibition established an efficient platform for communication and cooperation in the electronics and embedded systems sector, fostering communication and collaboration between upstream and downstream companies and promoting the transformation and application of technological innovations.
By showcasing cutting-edge technologies and products, it charted the course for industry development: Driven by the continued empowerment of AI, electronic devices will possess even more powerful intelligent perception, analysis, and decision-making capabilities; green technology will become a core driver of sustainable development in the industry, permeating the entire process from product design and production to application.
Although the elexcon 2025 exhibition has concluded, the innovative momentum and collaborative value it injected into the electronics industry continue to flourish. This exhibition not only provides a comprehensive review of current electronics industry technological achievements but also establishes a new development landscape for the electronics and embedded systems sector: “Technology-led, Collaboration-driven, Ecosystem-driven.” With the deepening integration of AI and green technology, the foundation for industrial collaboration and technological development established by this exhibition will continue to support breakthroughs in related areas such as industrial automation, smart consumer electronics, and automotive electronics, helping the global electronics industry seize opportunities and achieve higher-quality development in the new round of technological change.
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